TrendForce Sees CPO Test Platforms Consolidating Ahead of Scale-Up Test
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TrendForce expects the transition of co-packaged optics (CPO) toward volume production for AI data-center interconnects to shift competition in test equipment toward integrated electrical and optical measurement platforms. It identifies 2027 as a likely consolidation point for CPO test architectures and equipment investment, followed by a 2028 validation period for large-scale production readiness.
- TrendForce expects CPO test architectures and equipment investment to consolidate in 2027.
- Complete PIC testing, which may exceed 100 seconds per device, remains a key throughput constraint.
- Teradyne’s 2025 acquisition of Quantifi Photonics and Advantest’s 2026 partnerships reflect increased integration of optical and electrical test capabilities.
- TrendForce views 2028 as a validation period for CPO large-scale production readiness, not a confirmed production milestone.
- Integrated, automated and parallelized test platforms could become more important than standalone instruments as CPO scales.
The emerging CPO test-equipment market is increasingly defined by end-to-end throughput rather than optical-alignment precision alone, according to TrendForce. Optical alignment has already been reduced to seconds or sub-second durations, but complete testing of a single photonic integrated circuit (PIC) can still exceed 100 seconds. TrendForce therefore identifies full PIC test speed as a principal production bottleneck for CPO deployed in AI data-center interconnects.
The market response is moving toward tighter integration of automated test equipment, optical instrumentation and software. Teradyne acquired Quantifi Photonics in 2025 to strengthen its optical-measurement capabilities. Advantest, meanwhile, announced partnerships with VIAVI and SENKO in September 2026 and demonstrated a simulated modular CPO test process for volume production at ECOC 2026.
TrendForce expects 2027 to be a key year for the consolidation of CPO test architectures and equipment-investment directions. It characterizes 2028 as a period for validating whether CPO can move into large-scale production. These are forward-looking expectations, rather than confirmed dates for volume manufacturing.
The competitive field also includes suppliers building domestic capabilities in China. According to the source, 聯訊儀器 has introduced and is shipping a 65 GHz sampling oscilloscope at volume, while 羅博特科 completed its full acquisition of Germany-based ficonTEC in 2025. However, the source notes that China remains materially dependent on imported high-end measurement instruments, and volume shipment of a sampling oscilloscope does not by itself demonstrate readiness for a complete high-volume CPO test platform.
For data-center infrastructure supply chains, the development could create a distinct and strategically important manufacturing-infrastructure segment around CPO. If adoption advances, procurement value may move toward platforms that share costly optical instruments across stations, automate workflows and support parallel testing. That could increase the role of test-system integrators, packaging providers and high-volume test-service suppliers.
CPO scaling will depend on reducing test time and cost without compromising quality. This could shift procurement value from individual instruments to integrated platforms combining electrical and optical measurement, automation, optical alignment and high-volume test capabilities.
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