Shumate Engineering says USPTO granted patent covering HD/AC cooling-system functionality
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Shumate Engineering said the US Patent and Trademark Office has granted a utility patent covering the operational functionality of its Hybrid-Dry/Adiabatic-Cooling (HD/AC) system. The company said the patent follows a July 2025 patent covering the technology’s physical design.
- Shumate Engineering said USPTO granted a utility patent for HD/AC operational functionality.
- The company said the patent follows a July 2025 patent covering the system’s physical design.
- HD/AC combines 68°F water for CRAC cooling with 90°F water for direct-to-chip liquid cooling in a closed-loop configuration.
- The company claims reductions of 93% in water use, 50% in cooling power consumption and 15% in total connected power versus conventional cooling.
- No commercial deployment data or independent verification of the performance claims was provided.
Shumate Engineering has announced that the US Patent and Trademark Office granted a utility patent covering the core operating functionality of its Hybrid-Dry/Adiabatic-Cooling (HD/AC) system.
According to the company, the new patent protects the system’s operational logic and represents a second stage of its intellectual-property strategy. Shumate said a prior patent, issued in July 2025, covered the physical design of the technology.
HD/AC is described as a closed-loop cooling system using two water-temperature streams: 68°F water for conventional air-cooled computer room air conditioner (CRAC) systems, and 90°F water for direct-to-chip liquid cooling. In cooler periods, the system uses outside air in an economizer mode; in warmer conditions, it uses evaporative cooling as a trimming function.
Shumate claims that, compared with conventional cooling systems, HD/AC can reduce water use by 93%, cooling power consumption by 50%, and total connected power by 15%. These metrics, if validated under real operating conditions, could make the approach relevant to data-center projects balancing constrained water availability, grid-connected load limits and the transition toward liquid cooling for AI infrastructure.
The additional patent could raise barriers to replication of the system’s control and operational approach, rather than only its physical configuration. However, the available material does not identify commercial HD/AC installations, deployment scale, measured site performance or independent validation of the claimed savings.
The patent concerns cooling infrastructure intended for data centers facing higher AI and hyperscale thermal loads, water constraints and growing adoption of direct-to-chip liquid cooling. If its claimed performance is borne out in deployments, HD/AC could be relevant where water use, cooling power demand and connected-load limits must be managed simultaneously.
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