Schneider Electric outlines integrated power, liquid-cooling and digital design strategy for AI data centers
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Schneider Electric Japan has outlined an AI data-center infrastructure strategy combining high-power UPS systems, liquid cooling and digital tools for design, monitoring and operational optimization. The company is also developing a sidecar architecture intended to convert 400 V AC to 800 V DC for direct rack power delivery.
- Schneider Electric is positioning AI data-center infrastructure as an integrated power, cooling and digital-management stack.
- Galaxy VXL supports 500–1,250 kW of modular capacity within a 1.2 m² footprint.
- The proposed sidecar converts 400 V AC to 800 V DC, but remains under development rather than commercially deployed.
- The source describes roughly 200 kW per rack as current demand and 1 MW as a future expectation, not an established market-wide condition.
- The company’s portfolio spans liquid-cooling hardware and EcoStruxure IT, ETAP and AVEVA-linked digital tools.
Schneider Electric Japan has presented an AI data-center infrastructure portfolio centred on the integration of electrical power, liquid cooling and digital operations software.
The power component includes the three-phase Galaxy VXL UPS, which supports a modular power range of 500 kW to 1,250 kW and has a 1.2 m² installation footprint. For future high-density racks, the company said it is developing a sidecar device that receives 400 V AC and converts it to 800 V DC for direct rack supply. This is a development programme, not a commercially deployed product or an operational data-center installation.
The interview characterises approximately 200 kW as the current level of power demand reached by individual server racks, while describing 1 MW per rack as an expected level in the near future. The latter is a forward-looking expectation rather than a broadly achieved market condition.
Schneider Electric’s cooling offer includes cold plates, coolant distribution units, rear-door heat exchangers, chillers and floor-mounted heat distribution units. Its digital toolset includes EcoStruxure IT Advisor, EcoStruxure IT Expert and ETAP, with AVEVA integration for data-center design, monitoring and operational optimization.
The company’s presentation reflects the operational interdependence of power conversion, liquid heat removal and infrastructure modelling as GPU density rises. If rack loads approach the levels described in the interview, buyers could place greater emphasis on integrated power, cooling and software architectures. Cooling-water temperature requirements remain variable: the source cites differing customer preferences rather than a single industry standard, which could sustain demand for systems able to operate across different thermal regimes.
According to the interview, Schneider Electric reported group revenue of €40.2 billion in 2025, and data-center solutions accounted for 30% of group orders.
Rising GPU rack densities are increasing power-delivery, heat-rejection and infrastructure-management requirements simultaneously. Schneider Electric’s approach indicates how suppliers may increasingly compete on integrated architectures rather than stand-alone UPS or cooling equipment, although the company’s 800 V DC sidecar remains a development effort.
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