onsemi Announces Embedded Power Platform for AI Data-Center Power Systems

onsemi has announced Embedded Power Platform (EPP), a power-electronics platform that integrates FETs, drivers and controllers into a single package built on a silicon wafer. The platform uses silicon, silicon carbide and gallium nitride technologies and is aimed at AI data centers, electric vehicles and industrial systems.

The first application identified by the company is a solid-state circuit breaker (SSCB). For an EPP-based SSCB, onsemi claims approximately 50% lower volume and approximately 20% lower operating temperature than existing designs. The company also cites a potential 3x to 5x improvement in power density for EPP, although the scope and comparison methodology for that platform-level claim were not disclosed.

For data-center operators and power-system designers, the announcement is relevant because higher-power AI racks are tightening physical and thermal constraints beyond the compute layer. Power conversion, protection and distribution assemblies must increasingly fit within constrained electrical infrastructure footprints while managing heat. If the claimed SSCB characteristics are validated in serial products, they could free space in power-distribution equipment and lower the thermal load of that equipment.

EPP is at an early deployment stage. onsemi plans to begin supplying samples to strategic customers and ecosystem partners in the automotive and AI segments this year, but has not published a schedule for volume production. Subaru is among the early collaboration partners evaluating EPP for future electric-vehicle architectures; no corresponding named AI data-center customer was disclosed.

The market significance therefore remains contingent on qualification outcomes, reliability, cost and the transition from samples to volume manufacturing. The published performance figures are company claims, with no independent verification or comparison methodology provided.