NVIDIA Launches DSX Ready Program, Bringing BESS and CDU Equipment Into AI Factory Certification
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NVIDIA announced its DSX Ready program for AI Factory equipment on 21 September 2026, initially covering battery energy storage systems (BESS) and coolant distribution units (CDUs). Vertiv, LG Electronics and LiquidStack were named as initial CDU suppliers, as liquid-cooling vendors introduced or confirmed multi-megawatt systems for high-density AI deployments.
- NVIDIA’s DSX Ready program initially covers BESS and CDU equipment for AI Factory deployments.
- Vertiv, LG Electronics and LiquidStack are named as initial CDU suppliers under the program.
- Vertiv reported DSX Ready certification for a 2.3 MW CDU, while LG Electronics reported certification for a 2.6 MW unit.
- Motivair introduced a WCDU rated at up to 3.5 MW, with grouped operation of up to 20 units.
- NVIDIA DSX documentation cited by the source places cabinet TDP between 198 kW for MGX Gen 1.1 and 330 kW for Vera Rubin NVL72.
- Certification is not a substitute for site-specific data-centre engineering.
NVIDIA has launched NVIDIA DSX Ready, a certification mechanism for equipment designed to meet NVIDIA DSX requirements for AI Factory deployments. Announced on 21 September 2026, the program’s first equipment categories are BESS and CDUs.
LG Electronics, LiquidStack and Vertiv were identified as initial CDU suppliers. Vertiv said its 2.3 MW CDU was the first CDU to receive DSX Ready certification. LG Electronics subsequently announced DSX Ready certification for a 2.6 MW CDU; the company also cited previously certified 600 kW and 1 MW-class CDU offerings.
The announcements coincide with larger liquid-cooling equipment configurations aimed at high-density AI infrastructure. Schneider Electric, through its Motivair brand, introduced a water cooling distribution unit (WCDU) rated at up to 3.5 MW. The system can operate in groups of up to 20 units and is positioned for data halls in the 30–40 MW class. These figures describe equipment capability and design targets, rather than commissioned capacity at a specific data centre.
NVIDIA DSX design documentation cited by the source indicates cabinet TDP rising from 198 kW for MGX Gen 1.1 to 330 kW for Vera Rubin NVL72. Separately, Supermicro has reportedly begun shipments of NVIDIA Vera Rubin NVL72 systems together with direct liquid-cooling equipment.
For operators and designers, the relevant shift is toward cooling architectures designed around groups of high-density AI racks rather than individual racks in isolation. Multi-megawatt CDUs may increase the importance of validating cooling equipment not only for thermal performance, but also for compatibility with NVIDIA reference requirements, site power systems and the operating architecture of the facility. DSX Ready certification does not replace engineering design for an individual data-centre site.
The program positions liquid cooling as a standardised element of AI Factory configurations rather than a specialised infrastructure component. As rack TDP targets rise and CDU unit capacities reach several megawatts, interoperability among cooling, power systems and server platforms could become a more important design consideration for AI data-centre projects.
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