Mitsubishi Electric and Foxconn sign AI data-center infrastructure MoU targeting PUE 1.1

Mitsubishi Electric and Hon Hai Precision Industry (Foxconn) have entered into a memorandum of understanding covering global solutions for AI data centers designed for high energy efficiency and reliability.

Mitsubishi Electric’s investor-relations materials associate the collaboration with the development of Direct Liquid Cooling systems, including two-phase liquid cooling, free cooling and high-efficiency dry coolers. The scope also includes power systems, monitoring, control and energy-saving functions. The company has stated an objective of achieving PUE 1.1 through co-creation with Hon Hai; this is a target for jointly developed solutions, not a confirmed operating result for a live data center.

For AI infrastructure operators, the significance lies in the breadth of the proposed stack. Rather than positioning cooling as a standalone mechanical system, the companies are linking thermal management with power and energy-management functions and Foxconn’s server and manufacturing ecosystem. This could narrow the interface between data-center facility infrastructure and AI-cluster equipment, although the available information does not identify commercial deployments, customers or installed systems.

Mitsubishi Electric is also setting ambitious growth targets for its IT Cooling business. It reported IT Cooling revenue of JPY 32 billion in fiscal 2025 and plans to increase this to more than JPY 100 billion in fiscal 2030 and more than JPY 300 billion in fiscal 2035. These are corporate targets rather than future revenue already secured or achieved.

The source also refers to Mitsubishi Electric’s intention to establish a US manufacturing site for data-center cooling equipment. However, no location, capital expenditure, manufacturing capacity, start-up date or implementation status was disclosed in the material provided.