MBT showcases integrated power and cooling architecture for high-density AI data centers
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Midea Building Technologies (MBT) presented an integrated power-cooling architecture and cooling solutions for high-density AI data centers at Asia Data Centre World 2026 in Singapore. The company said the approach combines power systems, energy storage, magnetic-bearing cooling sources and liquid-cooling CDUs.
- MBT presented integrated power and cooling infrastructure for high-density AI data-center applications in Asia-Pacific.
- The proposed architecture combines power systems, energy storage, magnetic-bearing cooling sources and liquid-cooling CDUs.
- MBT released a technical white paper covering planning, construction and operation of AI data centers using the approach.
- The presentation illustrates the increasing convergence of liquid cooling, power infrastructure and cooling-source management for AI facilities.
- No commercial deployments or verified operating metrics were disclosed.
Midea Building Technologies presented its power-cooling hyperconverged architecture and a portfolio of cooling solutions for high-density AI data centers at Asia Data Centre World 2026, held at Marina Bay Sands in Singapore on 29–30 September.
MBT said its architecture integrates power systems, energy storage, magnetic-bearing cooling sources and liquid-cooling coolant distribution units into a single infrastructure approach. The company described it as an industry first, a claim that has not been independently verified in the available material.
The solutions are positioned for high-density computing, liquid-cooling deployments, tropical-climate conditions and lower-carbon operations in the Asia-Pacific market. MBT also released a technical white paper covering the use of the architecture across AI data-center planning, construction and operations.
According to the company’s description, coordinated operation of magnetic-bearing cooling sources, free cooling and liquid-cooling terminals can reduce reliance on mechanical cooling. More broadly, the presentation points to growing supplier competition around integrated AI data-center mechanical and electrical infrastructure, where liquid cooling is increasingly linked to power systems, energy storage and cooling-source control.
For operators, such approaches could broaden the range of integrated system options for high-density facilities and challenging climates. However, the available source provides no confirmed information on customer deployments, data-center capacity, CAPEX, PUE, measured energy savings or operational performance.
Rising AI rack densities are increasing the need to coordinate power delivery, energy storage and heat rejection rather than design these as separate facility systems. MBT’s concept reflects the market shift toward integrated infrastructure architectures that combine liquid cooling with power and cooling-source management, although no commercial deployment or operating-performance data were disclosed.
- — / 2 октября 2026 г. · АнглийскийПервоисточник →
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