LG Electronics, GS E&C and GRC Sign MOU for AI Data Center Immersion-Cooling Development
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LG Electronics, GS Engineering & Construction and Green Revolution Cooling have signed a memorandum of understanding to jointly develop immersion-cooling technology, integrated solutions and reference designs for AI data centers in South Korea. The partners plan to validate the technology’s applicability, performance and reliability through a testbed before developing an integrated offering.
- The agreement is an MOU for development and validation, not confirmation of a commercial AI data center deployment.
- GS E&C is to develop an AI data center reference architecture and operate the testbed.
- LG will provide cooling technologies and operational data across air, liquid and immersion systems.
- GRC is to provide immersion tanks and control technology.
- The partnership focuses on integrating immersion cooling with broader facility design and operations.
LG Electronics said on 14 October that it had signed an MOU with GS Engineering & Construction and US-based GRC (Green Revolution Cooling) to develop immersion-cooling technology and equipment for data centers. The signing ceremony took place on 13 October at GS E&C’s headquarters in Jongno-gu, Seoul.
The collaboration covers integrated cooling solutions and reference designs for AI data centers. The parties intend to assess the applicability, performance and reliability of the technology at a testbed, then develop an integrated solution.
LG will contribute air-, liquid- and immersion-cooling technologies, alongside operational data. GS E&C will develop a reference architectural design for an AI data center and operate the testbed. GRC will supply immersion tanks and control technology.
The arrangement extends LG’s AI data center cooling work from air and liquid systems into immersion cooling. Its significance lies in the planned co-design of cooling infrastructure with the physical and operational requirements of an AI facility, including building structure, floor loads, piping, electrical supply and maintenance areas. This could be material where GPU thermal loads make conventional facility design choices more constrained.
More broadly, the partnership could support the standardisation of immersion-cooling design approaches for AI data centers in South Korea. For suppliers, it suggests that competitiveness may depend not only on cooling hardware, but also on the ability to integrate it with facility architecture, power systems, piping and operating processes.
The agreement points to a design approach that treats cooling as part of the wider AI data center system rather than as standalone equipment. Integrating immersion cooling with building structure, floor loading, piping, power distribution and service areas could be important for practical deployment at high GPU thermal loads.
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