ITRI showcases AI data-center cooling and hydrogen energy demonstration in Tainan
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Taiwan’s Industrial Technology Research Institute (ITRI) used its Innovation Day in Shalun, Tainan, to present a high-density chip-cooling design for AI data centers and its operating hydrogen energy demonstration platform. The event highlighted technologies aimed at addressing the thermal and power constraints associated with semiconductor, data-center and AI expansion.
- ITRI presented a 3D aluminium microchannel thermosiphon cooler for AI-chip thermal management, with claimed heat-removal capacity of up to 1,600 W.
- ITRI claims the cooler improves maximum heat transfer by up to 33% versus a copper 3D vapor chamber and reduces chip-surface temperature by about 15°C.
- The Shalun hydrogen demonstration platform combines 1 MW of solar generation, electrolysis and hybrid hydrogen energy storage.
- Taiwan’s Ministry of Economic Affairs forecasts electricity-demand growth of about 2.5% per year in 2026–2035, including demand associated with semiconductors, data centers and AI.
- The disclosed projects are demonstrations; no commercial data-center deployment or customer has been identified.
ITRI held its Innovation Day in Shalun, Tainan, on September 15, presenting energy, sustainability and AI technologies, including systems relevant to AI data-center infrastructure.
For high-power AI hardware, ITRI showcased a 3D aluminium microchannel thermosiphon cooler with claimed heat-removal capacity of up to 1,600 W. Relative to a copper 3D vapor chamber, ITRI said the design increases maximum heat transfer by up to 33%, reduces chip-surface temperature by about 15°C and lowers manufacturing cost by about 40%.
The institute also described an operating hydrogen energy demonstration platform in Shalun built around a production-storage-transport-use model. The platform combines 1 MW of solar generation, hydrogen production by electrolysis and hybrid hydrogen energy storage. It is reported to produce about 2 kg of hydrogen per hour, with more than 20 domestic and international companies participating in validation activities.
The 1 MW figure applies to the solar-generation element of the hydrogen demonstration platform, not to data-center or IT capacity. No customer, commercial deployment, production volume, operating start date or adoption of the aluminium cooling technology at a specific data center was identified.
ITRI linked continued semiconductor development and future data-center growth to Taiwan’s electricity demand. The Ministry of Economic Affairs projects average annual demand growth of approximately 2.5% between 2026 and 2035, factoring in incremental demand from semiconductor fabs, data centers and AI technologies. In that context, the cooling and energy technologies presented could support efforts to reduce thermal and energy constraints on AI infrastructure growth, although the available information describes technology demonstrations rather than supply contracts or facility deployments.
ITRI’s presentations point to two parallel requirements for scaling AI infrastructure: managing rising chip heat loads and building more flexible, lower-carbon energy systems. Taiwan’s Ministry of Economic Affairs forecasts electricity demand growth of about 2.5% annually in 2026–2035, taking account of semiconductor expansion, data centers and AI. The technologies shown remain demonstrations rather than identified commercial deployments in a data center.
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