Goldman Sachs flags optical test and assembly equipment as early AI interconnect beneficiaries
Редакция ЦОД:Главное
Following meetings with eight companies during Semicon Taiwan, Goldman Sachs identified six trends in AI-driven optical communications. The firm highlighted expanding photonic integrated circuit production and rising demand for optical alignment and test equipment, with test-equipment suppliers positioned as early potential beneficiaries of CPO commercialisation.
- Goldman Sachs identified six AI-driven optical-communications trends after meetings with eight companies at Semicon Taiwan.
- PIC production, optical alignment and test equipment are emerging focal points in the high-speed-optics supply chain.
- Goldman Sachs views test-equipment providers as potential early beneficiaries of CPO commercialisation.
- Roboteco and FiconTEC are targeting substantially faster wafer- and die-level testing next year.
- CPO deployment volumes, customers and supplier capacity additions were not disclosed.
Goldman Sachs’ Semicon Taiwan findings point to a broadening equipment requirement around AI-driven optical interconnects, spanning photonic integrated circuits (PICs), automated optical alignment, testing, fibre-array-unit (FAU) assembly, laser components and CMP materials.
The clearest near-term activity is expected in production and test infrastructure rather than in confirmed volume deployment of co-packaged optics (CPO). Goldman Sachs considers test-equipment suppliers to be among the earliest potential beneficiaries as CPO moves toward commercialisation. At this early stage, testing, quality control and automated assembly may be relatively protected segments because these operations could be required before large-scale deployment of finished CPO products.
Roboteco and FiconTEC expect their equipment shipments over the next year to exceed 50% of their cumulative shipments over the preceding 25 years. The companies also target a 50–60% reduction in wafer-level test time next year and a fourfold increase in die-level test speed. These are company targets and shipment expectations, rather than reported operational results.
In optical-module assembly, Gaoming Tie says its dual-FA active-alignment equipment for 1.6T optical modules can reduce coupling time by 50% compared with conventional equipment. Shangquan’s FAU roadmap includes a primary 40-channel configuration in 2026, an 80-channel product for 6.4T applications, and a 100-channel product in research and development. The available source material does not fully specify the calendar-date context for an associated current-year third-quarter timing reference.
The technology scope extends beyond CPO to NPO, silicon photonics, optical chiplets and high-speed optical modules. The underlying implication is that AI data-center networking requirements may accelerate investment across the high-speed-optics manufacturing chain. However, the information presented does not establish actual CPO deployment volumes, specific customers, equipment capacity additions or revenue outcomes.
AI workloads are raising bandwidth and speed requirements for data-center interconnects. This could shift more value toward the specialised manufacturing, test and assembly equipment required for high-speed optics, including potential CPO deployments, before end-market CPO volumes are established.
- TechNews 科技新報 / КитайскийПервоисточник →
Материал подготовлен редакцией ЦОД: Главное на основе указанных первоисточников.