Cooler Master Showcases 2.5 MW In-Row CDU, Targets Q4 2026 Production
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Cooler Master has showcased a liquid-cooling portfolio for AI data centers at the OCP Global Summit 2026, led by a liquid-to-liquid in-row coolant distribution unit (CDU) with claimed cooling capacity of up to 2,500 kW. The company is targeting serial production of the CDU in the fourth quarter of 2026.
- The showcased in-row CDU has claimed cooling capacity of up to 2,500 kW.
- Cooler Master is targeting serial production in Q4 2026, not claiming current operational deployment.
- The system includes claimed centralized management for up to 32 interconnected CDUs.
- The portfolio is positioned for new AI facilities and retrofits supporting higher-density compute.
- No customers, orders, pricing, deployment volumes or verified field-performance data were disclosed.
Cooler Master used the OCP Global Summit 2026 in San Jose to present a liquid-cooling portfolio aimed at AI data centers and high-density HPC environments.
The central product is a liquid-to-liquid in-row CDU with claimed cooling capacity of up to 2,500 kW. This figure refers to the cooling capacity of the equipment, rather than the IT load of a specific data center or AI cluster. The company states that the capacity is delivered at 990 GPM, with a 4–5°C approach temperature difference.
Cooler Master also describes a dual-system architecture with intelligent load balancing, alongside centralized management for up to 32 interconnected CDUs. The stated design focus is on operators developing new AI facilities or retrofitting existing sites for higher-density compute.
The company has targeted the fourth quarter of 2026 for serial production. The system was demonstrated rather than presented as an operating deployment, and the available information does not identify customers, orders, shipment volumes, pricing or installations.
The announcement reflects the market's move toward larger modular liquid-cooling components for dense AI and HPC clusters. If serial production is achieved, the CDU could broaden cooling-architecture choices for data-center operators deploying or upgrading liquid-cooled capacity. Its commercial and operational position, however, remains unproven pending confirmed deployments and field-performance data.
As AI and HPC clusters drive higher rack heat densities, high-capacity CDUs could support operators moving beyond conventional air cooling toward liquid-cooled architectures. The product may add an option for new AI facilities and higher-density retrofits if it reaches serial production, but no deployments, customer orders or operational performance have been disclosed.
- — / 16 октября 2026 г. · АнглийскийПервоисточник →
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